Diamond Wire Saw
Author:liliang Time:2018-07-20 17:58:00
Diamond wire saw, also known as diamond wire, refers to the use of electroplating process or resin bonding method, the diamond abrasive fixed on metal wire.
In 1990s, in order to solve the problem of large size silicon wafer processing, wire saw technology was used to cut silicon rods into chips. This technology has been successfully applied to the processing of silicon and silicon carbide. In order to further shorten the processing time, and to process other hard and difficult ceramics, the diamond abrasives are fixed to the metal line in a certain way, thus producing a fixed diamond wire saw.
Diamond wire saw, also known as diamond wire, refers to the use of electroplating process or resin bonding method, the diamond abrasive fixed on metal wire.
Type
1. electroplating: electroplating is used to deposit a layer of metal (generally nickel and nickel cobalt alloy) on metal wire and a linear superhard material made of diamond abrasive in metal. Metal coating is a binder and diamond abrasive is used for cutting.
2.Resin type: using the resin as bond, the diamond abrasive is consolidated on the wire.
Application area
1. Solar energy field: silicon wafer or silicon wafer.
2.LED field: sapphire crystal rod open, sliced.
Raw material diamond selection
In order to make the diamond abrasive more firmly attached to the steel wire, it is necessary to pretreat the diamond, which is to coat the diamond. The raw material diamond should be less poly-crystalline, good sharp, and high purity.
Liliang Diamond specialized in industrial synthetic diamond over many years, diamond abrasive for diamond wire saw is one of our popular products, more information please refer to our website www.llgem.com